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The objective of Packaging of Future Integrated Modular Electronics (PRIMAE) is to develop a new packaging concept for embedded electronics for future aircraft. PRIMAE is carried out by a European consortium of nineteen partners consisting of companies, universities and institutes covering the various domains.
PRIMAE technical objectives are:
- Reduce electronics packaging in terms of volume (50%) and weight (30%) and offer flexibility and growth capability
- Reduce costs (20%) using market standard components
- Enhance reliability (50%) through thermal and vibratory breakthrough
- Mitigate EMC protection penalties in composite fuselage environment
- Ensure fast production ramp up and support rapid final assembly on aircraft
- Improve availability and reduce maintenance cost
The partners will carry out technological studies beyond the state of the art in areas of cooling, lightweight composite materials, electromagnetic interferences, power supply and connectivity while taking into account the airworthiness regulations.
DTC’s main task is to investigate the application of thermoplastic composite material for construction of a rack. One of the major deliverables is a rack mock-up that will be designed in cooperation with the University of Aalto (Finland).
PRIMAE is carried out under the Seventh Framework Programme for research and technological development (FP7), which is funded by the European Union. The project was kicked-off on the 19th of November 2010 and runs for a period of 42 months.
For more information, please visit the PRIMAE website.
